半导体封装概念股市资讯复盘:
开盘:报跌
沪硅产业(23.570,-0.430,-1.792%)领跌,飞凯材料(15.560,-0.240,-1.519%) 、晶方科技(58.740,-0.540,-0.911%) 、长电科技(32.880,-0.290,-0.874%) 等跟跌。早盘:报涨
歌尔股份(26.150,0.940,3.729%)领涨,飞凯材料(16.080,0.280,1.772%) 、芯朋微(69.210,1.200,1.764%) 等跟涨。上午收盘:报涨
歌尔股份(26.000,0.790,3.134%)领涨,深科技(19.810,0.270,1.382%) 、芯朋微(68.930,0.920,1.353%) 等跟涨。午后:报涨
歌尔股份(26.140,0.930,3.689%)领涨,芯朋微(69.200,1.190,1.750%) 、深科技(19.840,0.300,1.535%) 、通富微电(19.280,0.080,0.417%) 、太极实业(8.480,0.020,0.236%) 等跟涨。尾盘:报跌
沪硅产业(23.270,-0.730,-3.042%)领跌,木林森(12.840,-0.310,-2.357%) 、赛腾股份(24.610,-0.400,-1.599%) 等跟跌。收盘:报跌
沪硅产业(23.230,-0.770,-3.208%)领跌,木林森(12.880,-0.270,-2.053%) 、赛腾股份(24.590,-0.420,-1.679%) 等跟跌。本文选取数据仅作为参考,并不能全面、准确地反映任何一家企业的未来,并不构成投资建议,据此操作,风险自担。